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M&A Deal Announcement | Tentt Deal Tracker

Announced
TechnologyWashingtonPlatform

Deal Overview

Data I/O Corporation has agreed to acquire a semiconductor handling and packaging manufacturer, an enterprise software business in Washington, for $23 million. The target provides solutions used in semiconductor processing and assembly, expanding Data I/O’s platform acquisition beyond flash memory and microcontrollers into broader semiconductor manufacturing workflows. Data I/O, a technology provider of data provisioning solutions for flash memory, microcontrollers, and security ICs, seeks programming and at-test capabilities to support EMS providers and OEMs in Redmond, WA. The strategic acquisition is structured as a platform deal with strategic buyer intent, expected to be accretive to earnings and cash flow, and includes consideration up to 15% paid in Data I/O stock. The transaction is announced as an LOI with a $10M–$25M deal size range and aims to diversify revenue beyond automotive electronics.

Key Details

Deal Size
$10M – $25M
Reported Value
$23 million

Source

Read full article on globenewswire.com

via GlobeNewswire — M&A · May 14, 2026

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