NEXX Acquired by Applied Materials | Technology M&A Deal

Applied Materials has acquired NEXX, a technology other business in Massachusetts. Applied Materials acquisitions aim to expand advanced packaging deposition capabilities by adding NEXX’s large-area panel-level equipment for semiconductor manufacturing. NEXX provides advanced packaging deposition technology that supports fine-pitch I/O wiring and larger-format 2.5D and 3D chiplet architectures, including HBM and GPU-integrated AI accelerators. The technology M&A is structured as an add on acquisition by a public company acquirer, with the NEXX team and products strengthening Applied’s panel processing portfolio. The deal is announced and expected to close within the next several months under a definitive agreement.